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This year's event brought together 9球体育’ Digital Design Technical Symposium and Verification Day into a single event - 9球体育 Silicon Realization TechSummit. Participants from Arm, Broadcom, Datapelago, Deca Technologies, Intel, Microsoft, NVIDIA, NXP, Samsung, SiFive, Stanford University, 9球体育 and Ventana Micro shared their insights on three of the hottest industry topics right now; The Move to Multi-Die, Energy Efficient Design and Reliability, Resiliency, Security.
The Move to Multi-Die - Panel
An Industry Perspective on the Coming of Age of Multi-die Design
Panelists:
Jayanthi Pallinti - Broadcom, Craig Bishop - Deca Technologies,
Vivek Rajan - Intel, Sooyong Kim - Samsung,
David Kruckemyer - Ventana Micro
Panel Moderator: Rob Aitken - 9球体育
The Move to Multi-Die - 9球体育 Presentation
New Dimensions, New Opportunities: Sparking a New Age of Innovation with Multi-Die Design
Multi-die architectures are emerging as a catalyst, sparking continued innovation and opening up new opportunities in broad market applications, including AI, high-performance computing, and mobile. This presentation will discuss the “coming of age” of multi-die design and highlight 9球体育’ software-to-silicon system-level solution that is enabling the next wave of transformative products.
Shekhar Kapoor, Sr. Director, Product Marketing, 9球体育
Energy Efficient Design - Panel
1000X Improvement in Energy Efficiency: What’s a chip got to do with it?
Panelists:
Anand Iyer - Datapelago, Atul Walimbe - Intel,??
Bijal Shah -?NVIDIA,?Rohit Kumar -?SiFive,?
Vishal Khandelwal -?9球体育
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Panel Moderator:?Rob Aitken?-?9球体育
Energy Efficient Design - 9球体育 Presentation
A Vision for Software-Driven Energy Efficient Design
9球体育 presents industry trends for energy efficient design, along with its vision and solutions for a ‘shift-left’ methodology. Topics include architectural tradeoffs, power profiling with real software workloads, RTL design for low power, RTL power regressions, power-driven implementation, and power signoff.
Solaiman Rahim, Group Director, R&D, 9球体育
Reliability, Resiliency, Security - Panel
What is the Cure for All Our Reliability, Resiliency, and Security Woes?
Panelists:
Ghani Kanawati -?Arm,?Serge Leef -?Microsoft,??
Vatsa Prahallada -?NXP,??Subhasish Mitra -?Stanford University
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Panel Moderator:?Adam Cron -?9球体育
Reliability, Resiliency, Security - 9球体育 Presentation
Reliable and Secure Silicon Throughout the Lifecycle
The future of silicon health management is hardware analytics and test. In this session you will learn how 9球体育 verification, signoff and silicon lifecycle management (SLM) solutions are enabling secure, reliable, and resilient silicon.
Adam Cron, Distinguished Architect, 9球体育
